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Dec 6 2019

TMS32C6414DGLZ6E3 Datasheet PDF – IC DSP FIXED-POINT 532-BGA TI

Product Overview

Product Category:

Embedded - DSP (Digital Signal Processors)

Kynix Part #:

KY32-TMS32C6414DGLZ6E3

Manufacturer Part#:

TMS32C6414DGLZ6E3

Manufacturer

TI

Description:

IC DSP FIXED-POINT 532-BGA

Package:

532-BFBGA, FCBGA

Datasheet:

TMS32C6414DGLZ6E3 Datasheet

Stock:

Yes

Quantity:

516 PCS


TMS32C6414DGLZ6E3 Images are for reference only:

TMS32C6414DGLZ6E3


Product Specifications

Product Category

Embedded - DSP (Digital Signal Processors)

Manufacturer

TI

Series

TMS320C6414/15/16

Address Bus Width

32.0

Bit Size

32

Barrel Shifter

No

Boundary Scan

Yes

Clock Rate

600 MHz

Clock Frequency-Max

75.18 MHz

Data Bus Width

32 bit

External Data Bus Width

64.0

Format

FIXED POINT

Frequency

600 MHz

Interface

Host Interface, McBSP

Instruction Type

Fixed Point

Internal Bus Architecture

MULTIPLE

JESD-30 Code

S-PBGA-B532

JESD-609 Code

e0

Low Power Mode

Yes

Mounting Type

Surface Mount

Mounting Style

SMD/SMT

Moisture Sensitivity Level

4

Maximum Clock Frequency

600 MHz

Non-Volatile Memory

External

Number of I/Os

16

Number of Pins

532

Number of Terminals

532

On-Chip RAM

1.03 MB

Operating Temperature-Min

0.0 °C

Operating Temperature-Max

90.0 °C

Product

DSPs

Product Type

DSP - Digital Signal Processors & Controllers

Power Supplies

1.4,3.3

Package Body Material

PLASTIC/EPOXY

Package Code

HFBGA

Package / Case

532-BFBGA, FCBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Package Equivalence Code

BGA532,26X26,32

Program Memory Size

128 kB

Program Memory Type

Asynchronous SRAM, Synchronous SDRAM, SBSRAM

Peak Reflow Temperature (Cel)

220 °C

RAM (words)

16384

REACH Compliant

Yes

Sub Category

Digital Signal Processors

Seated Height-Max

3.3 mm

Supplier Device Package

532-FCBGA (23x23)

Supply Voltage-Nom

1.4 V

Supply Voltage-Min

1.36 V

Supply Voltage-Max

1.44 V

Surface Mount

Yes

Type

Fixed Point

Technology

CMOS

Terminal Finish

TIN LEAD

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max

NOT SPECIFIED

Unit Weight

0.110457 oz

Voltage - I/O

3.30 V

Voltage - Core

1.40 V

Length

23.0 mm

Width

23.0 mm


TMS320C6414TBGLZ1 Datasheet PDF Download:

 TMS32C6414DGLZ6E3 Datasheet PDF

Functional Block and CPU (DSP core) Diagram

Figure 1. Functional Block and CPU (DSP core) Diagram 

Figure 1. Functional Block and CPU (DSP core) Diagram

Description

The TMS320C64xDSPs (including the TMS320C6414T, TMS320C6415T, and TMS320C6416T devices†) are the highest-performance fixed-point DSP generation in the TMS320C6000DSP platform. The TMS320C64x(C64x) device is based on the second-generation high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture (VelociTI.2) developed by Texas Instruments (TI), making these DSPs an excellent choice for wireless infrastructure applications. The C64x is a code-compatible member of the C6000 DSP platform.

With performance of up to 8000 million instructions per second (MIPS) at a clock rate of 1 GHz, the C64x devices offer cost-effective solutions to high-performance DSP programming challenges. The C64x DSPs possess the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs)— with VelociTI.2 extensions. The VelociTI.2 extensions in the eight functional units include new instructions to accelerate the

performance in key applications and extend the parallelism of the VelociTI architecture. The C64x can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 4000 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 8000 MMACS. The C64x DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices.

The C6416T device has two high-performance embedded coprocessors [Viterbi Decoder Coprocessor (VCP) and Turbo Decoder Coprocessor (TCP)] that significantly speed up channel-decoding operations on-chip. The VCP operating at CPU clock divided-by-4 can decode over 833 7.95-Kbps adaptive multi-rate (AMR) [K = 9, R = 1/3] voice channels. The VCP supports constraint lengths K = 5, 6, 7, 8, and 9, rates R = 1/2, 1/3, and 1/4, and flexible polynomials, while generating hard decisions or soft decisions. The TCP operating at CPU clock divided-by-2 can decode up to sixty 384-Kbps or ten 2-Mbps turbo encoded channels (assuming 6 iterations). The TCP implements the max*log-map algorithm and is designed to support all polynomials and rates required by Third-Generation Partnership Projects (3GPP and 3GPP2), with fully programmable frame length and turbo interleaver. Decoding parameters such as the number of iterations and stopping criteria are also programmable. Communications between the VCP/TCP and the CPU are carried out through the EDMA controller.

The C64x uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 128-Kbit direct mapped cache and the Level 1 data cache (L1D) is a 128-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 8-Mbit memory space that is shared between program and data space. L2 memory can be configured as mapped memory or combinations of cache (up to 256K bytes) and mapped memory. The peripheral set includes three multichannel buffered serial ports (McBSPs); an 8-bit Universal Test and Operations PHY Interface for Asynchronous Transfer Mode (ATM) Slave [UTOPIA Slave] port [C6415T/C6416T only]; three 32-bit general-purpose timers; a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a peripheral component interconnect (PCI) [C6415T/C6416T only]; a general-purpose input/output port (GPIO) with 16 GPIO pins; and two glueless external memory interfaces (64-bit EMIFA and 16-bit EMIFB‡), both of which are capable of interfacing to synchronous and asynchronous memories and peripherals.

The C64x has a complete set of development tools which includes: an advanced C compiler with C64x-specific enhancements, an assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.

Features

· Highest-Performance Fixed-Point DSPs

− 1.67-/1.39-/1.17-/1-ns Instruction Cycle

− 600-/720-/850-MHz, 1-GHz Clock Rate

− Eight 32-Bit Instructions/Cycle

− Twenty-Eight Operations/Cycle

− 4800, 5760, 6800, 8000 MIPS

− Fully Software-Compatible With C62x

− C6414/15/16 Devices Pin-Compatible

− Extended Temperature Devices Available

· VelociTI.2 Extensions to VelociTI Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x DSP Core

− Eight Highly Independent Functional Units With VelociTI.2 Extensions:

− Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle

− Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle

− Non-Aligned Load-Store Architecture

− 64 32-Bit General-Purpose Registers

− Instruction Packing Reduces Code Size

− All Instructions Conditional

· Instruction Set Features

− Byte-Addressable (8-/16-/32-/64-Bit Data)

− 8-Bit Overflow Protection

− Bit-Field Extract, Set, Clear

− Normalization, Saturation, Bit-Counting

− VelociTI.2 Increased Orthogonality

· VCP [C6416T Only]

− Supports Over 833 7.95-Kbps AMR

− Programmable Code Parameters

· TCP [C6416T Only]

− Supports up to 10 2-Mbps or 60 384-Kbps 3GPP (6 Iterations)

− Programmable Turbo Code and Decoding Parameters

· L1/L2 Memory Architecture

− 128K-Bit (16K-Byte) L1P Program Cache (Direct Mapped)

− 128K-Bit (16K-Byte) L1D Data Cache (2-Way Set-Associative)

− 8M-Bit (1024K-Byte) L2 Unified Mapped RAM/Cache (Flexible Allocation)

· Two External Memory Interfaces (EMIFs)

− One 64-Bit (EMIFA), One 16-Bit (EMIFB)

− Glueless Interface to Asynchronous Memories (SRAM and EPROM) and Synchronous Memories (SDRAM, SBSRAM, ZBT SRAM, and FIFO)

− 1280M-Byte Total Addressable External Memory Space

· Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)

· Host-Port Interface (HPI)

− User-Configurable Bus Width (32-/16-Bit)

· 32-Bit/33-MHz, 3.3-V PCI Master/Slave Interface Conforms to PCI Specification 2.2 [C6415T/C6416T]

− Three PCI Bus Address Registers: Prefetchable Memory Non-Prefetchable Memory I/O

− Four-Wire Serial EEPROM Interface

− PCI Interrupt Request Under DSP Program Control

− DSP Interrupt Via PCI I/O Cycle

· Three Multichannel Buffered Serial Ports

− Direct Interface to T1/E1, MVIP, SCSA Framers

− Up to 256 Channels Each

− ST-Bus-Switching-, AC97-Compatible

− Serial Peripheral Interface (SPI) Compatible (Motorola)

· Three 32-Bit General-Purpose Timers

· UTOPIA [C6415T/C6416T]

− UTOPIA Level 2 Slave ATM Controller

− 8-Bit Transmit and Receive Operations up to 50 MHz per Direction

− User-Defined Cell Format up to 64 Bytes

· Sixteen General-Purpose I/O (GPIO) Pins

· Flexible PLL Clock Generator

· IEEE-1149.1 (JTAG†) Boundary-Scan-Compatible

· 532-Pin Ball Grid Array (BGA) Package (GLZ/ZLZ/CLZ Suffixes), 0.8-mm Ball Pitch

· 0.09-µm/7-Level Cu Metal Process (CMOS)

· 3.3-V I/Os, 1.1-V Internal (600 MHz)

· 3.3-V I/Os, 1.2-V Internal (720/850 MHZ, 1 GHz)


Other data sheets within the file:

Datasheet


TMS32C6414DGLZ6E3 Datasheet

TMS32C6414DGLZ6E3 Datasheet

TMS320C6414-16 Errata

TMS320C6414-16 Errata

TMS320C6414 Hardware Appl

TMS320C6414 Hardware Appl


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