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Mar 28 2019

SPC5602BF1MLQ6 Datasheet PDF - 32-bit Microcontrollers MCU SPC5602B

Product Overview

Product Category:

Microcontrollers

Kynix Part #:

KY32-SPC5602BF1MLQ6

Manufacturer Part#:

SPC5602BF1MLQ6

Manufacturer

NXP / Freescale

Description:

MCU 32-bit e200 RISC 256KB Flash 3.3V/5V Automotive 144-Pin LQFP Tray

Package:

LQFP-144

Datasheet:

SPC5602BF1MLQ6 Datasheet

Stock:

Yes

Quantity:

2900PCS

SPC5602BF1MLQ6 Images are for reference only:

SPC5602BF1MLQ6

Product Specifications

Product Category

32-bit Microcontrollers - MCU

Manufacturer

NXP

Mounting Style

SMD/SMT

Package / Case

LQFP-144

Series

MPC5602B/C

Core

e200z0

Data Bus Width (bit)

32

Maximum Clock Frequency (MHz)

64

Program Memory Size (kB)

256

Data RAM Size (kB)

24

ADC Resolution(bit)

10

Number of I/Os

123 I/O

Operating Supply Voltage (V)

3~3.6

Minimum Operating Temperature (°C)

- 40

Maximum Operating Temperature (°C)

+ 125

Interface Type

Flash

Brand

NXP / Freescale

Data RAM Type

RAM

Number of ADC Channels

36

Subcategory

Microcontrollers - MCU

Supply Voltage - Max (V)

3.6

Supply Voltage - Min (V)

3.0

RoHs Status

Lead free / RoHS Compliant

Lifecyle

Obsolete

EU RoHS

Yes

EU RoHS Version

2011/65/EU, 2015/863

Part Number Code

View Code

Introduction Date

2006-03-02 00:00:00

Supplier Cage Code

H1R01

HTSUSA

8542310001

Family Name

MPC56xx

Instruction Set Architecture

RISC

Maximum Clock Rate

64MHz

Maximum CPU Frequency

64MHz

Device Core

e200

Program Memory Type

Flash

Core Architecture

e200

Programmability

Yes

Number of Timers

7

Interface Type

CAN/I2C/SCI/SPI

CAN

2

I2C

1

SPI

3

Ethernet

0

UART

0

USART

0

USB

0

I2S

0

Maximum Operating Supply Voltage (V)

3.6 | 5.5

ADC Resolution

10bit

Number of ADCs

Single

Basic Package Type

Lead-Frame SMT

Package Family Name

QFP

Supplier Package

LQFP

Package Description

Low Profile Quad Flat Package

Lead Shape

Gull-wing

Pin Count

144

PCB

144

Package Length (mm)

20

Package Width (mm)

20

Package Height (mm)

1.45(Max)

Seated Plane Height (mm)

1.6(Max)

Pin Pitch (mm)

0.5

Package Weight (g)

1.3191

Package Material

Plastic

Mounting

Surface Mount

Jedec

MS-026BFB

Maximum Reflow Temperature (°C)

260

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Reflow Solder Time (Sec)

40

Number of Reflow Cycle

3

Lead Finish(Plating)

Sn

Terminal Base Material

Cu Alloy

SPC5602BF1MLQ6 Datasheet PDF Download:

SPC5602BF1MLQ6 Datasheet PDF

Package pinouts

MPC560xB LQFP 64-pin configuration.jpg

Fig. 1 MPC560xB LQFP 64-pin configuration

MPC560xC LQFP 64-pin configuration.jpg

Fig. 2 MPC560xC LQFP 64-pin configuration

LQFP 100-pin configuration.jpg

Fig. 3 LQFP 100-pin configuration

LQFP 144-pin configuration.jpg

Fig. 4 LQFP 144-pin configuration


Block diagram

block diagram of the MPC5604B C device series.jpg

Fig. 5 block diagram of the MPC5604B C device series


Description

The MPC5604B/C is a family of next generation microcontrollers built on the Power Architecture® embedded category.

The MPC5604B/C family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding family of automotive-focused products designed to address the next wave of body electronics applications within the vehicle. The advanced and cost-efficient host processor core of this automotive controller family complies with the Power Architecture embedded category and only implements the VLE (variable-length encoding) APU, providing improved code density. It operates at speeds of up to 64 MHz and offers high performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users implementations.

Features

Single issue, 32-bit CPU core complex (e200z0)

– Compliant with the Power Architecture® embedde category

– Includes an instruction set enhancement allowing variable length encoding (VLE) for code size footprint reduction. With the optional encoding of mixed 16-bit and 32-bit instructions, it is possible to achieve significant code size footprint reduction.

Up to 512 KB on-chip code flash supported with the flash controller and ECC

64 (4×16) KB on-chip data flash memory with ECC

Up to 48 KB on-chip SRAM with ECC

Memory protection unit (MPU) with 8 region descriptors and 32-byte region granularity

Interrupt controller (INTC) with 148 interrupt vectors, including 16 external interrupt sources and 18 external interrupt/wakeup sources

Frequency modulated phase-locked loop (FMPLL)

Crossbar switch architecture for concurrent access toperipherals, flash memory, or RAM from multiple bus masters

Boot assist module (BAM) supports internal flash programming via a serial link (CAN or SCI)

Timer supports input/output channels providing a range of 16-bit input capture, output compare, and pulse width modulation functions (eMIOS-lite)

10-bit analog-to-digital converter (ADC)

3 serial peripheral interface (DSPI) modules

Up to 4 serial communication interface (LINFlex) modules

Part NumberSPC5602BF1MLQ6
Description32-bit Microcontrollers - MCU SPC5602B (BOLERO 256K Phantom)

SPC5602BF1MLQ6 PDF

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