Product Overview
Product Category: | Microcontrollers |
Kynix Part #: | KY32-SPC5602BF1MLQ6 |
Manufacturer Part#: | SPC5602BF1MLQ6 |
Manufacturer | NXP / Freescale |
Description: | MCU 32-bit e200 RISC 256KB Flash 3.3V/5V Automotive 144-Pin LQFP Tray |
Package: | LQFP-144 |
Datasheet: | |
Stock: | Yes |
Quantity: | 2900PCS |
SPC5602BF1MLQ6 Images are for reference only:
Product Specifications
Product Category | 32-bit Microcontrollers - MCU |
Manufacturer | NXP |
Mounting Style | SMD/SMT |
Package / Case | LQFP-144 |
Series | MPC5602B/C |
Core | e200z0 |
Data Bus Width (bit) | 32 |
Maximum Clock Frequency (MHz) | 64 |
Program Memory Size (kB) | 256 |
Data RAM Size (kB) | 24 |
ADC Resolution(bit) | 10 |
Number of I/Os | 123 I/O |
Operating Supply Voltage (V) | 3~3.6 |
Minimum Operating Temperature (°C) | - 40 |
Maximum Operating Temperature (°C) | + 125 |
Interface Type | Flash |
Brand | NXP / Freescale |
Data RAM Type | RAM |
Number of ADC Channels | 36 |
Subcategory | Microcontrollers - MCU |
Supply Voltage - Max (V) | 3.6 |
Supply Voltage - Min (V) | 3.0 |
RoHs Status | Lead free / RoHS Compliant |
Lifecyle | Obsolete |
EU RoHS | Yes |
EU RoHS Version | 2011/65/EU, 2015/863 |
Part Number Code | View Code |
Introduction Date | 2006-03-02 00:00:00 |
Supplier Cage Code | H1R01 |
HTSUSA | 8542310001 |
Family Name | MPC56xx |
Instruction Set Architecture | RISC |
Maximum Clock Rate | 64MHz |
Maximum CPU Frequency | 64MHz |
Device Core | e200 |
Program Memory Type | Flash |
Core Architecture | e200 |
Programmability | Yes |
Number of Timers | 7 |
Interface Type | CAN/I2C/SCI/SPI |
CAN | 2 |
I2C | 1 |
SPI | 3 |
Ethernet | 0 |
UART | 0 |
USART | 0 |
USB | 0 |
I2S | 0 |
Maximum Operating Supply Voltage (V) | 3.6 | 5.5 |
ADC Resolution | 10bit |
Number of ADCs | Single |
Basic Package Type | Lead-Frame SMT |
Package Family Name | QFP |
Supplier Package | LQFP |
Package Description | Low Profile Quad Flat Package |
Lead Shape | Gull-wing |
Pin Count | 144 |
PCB | 144 |
Package Length (mm) | 20 |
Package Width (mm) | 20 |
Package Height (mm) | 1.45(Max) |
Seated Plane Height (mm) | 1.6(Max) |
Pin Pitch (mm) | 0.5 |
Package Weight (g) | 1.3191 |
Package Material | Plastic |
Mounting | Surface Mount |
Jedec | MS-026BFB |
Maximum Reflow Temperature (°C) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Reflow Solder Time (Sec) | 40 |
Number of Reflow Cycle | 3 |
Lead Finish(Plating) | Sn |
Terminal Base Material | Cu Alloy |
SPC5602BF1MLQ6 Datasheet PDF Download:
Package pinouts
Fig. 1 MPC560xB LQFP 64-pin configuration
Fig. 2 MPC560xC LQFP 64-pin configuration
Fig. 3 LQFP 100-pin configuration
Fig. 4 LQFP 144-pin configuration
Block diagram
Fig. 5 block diagram of the MPC5604B C device series
Description
The MPC5604B/C is a family of next generation microcontrollers built on the Power Architecture® embedded category.
The MPC5604B/C family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding family of automotive-focused products designed to address the next wave of body electronics applications within the vehicle. The advanced and cost-efficient host processor core of this automotive controller family complies with the Power Architecture embedded category and only implements the VLE (variable-length encoding) APU, providing improved code density. It operates at speeds of up to 64 MHz and offers high performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users implementations.
Features
• Single issue, 32-bit CPU core complex (e200z0)
– Compliant with the Power Architecture® embedde category
– Includes an instruction set enhancement allowing variable length encoding (VLE) for code size footprint reduction. With the optional encoding of mixed 16-bit and 32-bit instructions, it is possible to achieve significant code size footprint reduction.
• Up to 512 KB on-chip code flash supported with the flash controller and ECC
• 64 (4×16) KB on-chip data flash memory with ECC
• Up to 48 KB on-chip SRAM with ECC
• Memory protection unit (MPU) with 8 region descriptors and 32-byte region granularity
• Interrupt controller (INTC) with 148 interrupt vectors, including 16 external interrupt sources and 18 external interrupt/wakeup sources
• Frequency modulated phase-locked loop (FMPLL)
• Crossbar switch architecture for concurrent access toperipherals, flash memory, or RAM from multiple bus masters
• Boot assist module (BAM) supports internal flash programming via a serial link (CAN or SCI)
• Timer supports input/output channels providing a range of 16-bit input capture, output compare, and pulse width modulation functions (eMIOS-lite)
• 10-bit analog-to-digital converter (ADC)
• 3 serial peripheral interface (DSPI) modules
• Up to 4 serial communication interface (LINFlex) modules
Part Number | SPC5602BF1MLQ6 |
Description | 32-bit Microcontrollers - MCU SPC5602B (BOLERO 256K Phantom) |