Product Overview
Product Category: | IC Chips |
Kynix Part #: | KY32-S9S08SG16E1MTLR |
Manufacturer Part#: | S9S08SG16E1MTLR |
Manufacturer | NXP USA Inc. |
Description: | IC MCU 8BIT 16KB FLASH 28TSSOP |
Package: | 28-TSSOP (0.173", 4.40mm Width) |
Datasheet: | |
Stock: | Yes |
Quantity: | 6060 PCS |
S9S08SG16E1MTLR Images are for reference only:
Product Specifications
Categories | Integrated Circuits (ICs) Embedded - Microcontrollers |
Base Part Number | S9S08SG16 |
Part Status | Active |
Brand | NXP Semiconductors |
ADC Channels | 16 |
ADC Resolution (bit) | 10 |
Analog Comparators | 1 |
CAN | 0 |
CECC Qualified | No |
Connectivity | I2C, SCI, SPI |
Core Processor | S08 |
Core Size | 8-Bit |
Data Bus Width | 8 bit |
Data Converters | A/D 16x10b |
Data RAM Type | RAM |
ECCN (US) | EAR99 |
EEPROM Size | - |
Ethernet | 0 |
EU RoHS Compliant | Yes |
HTS Code | 8542.31.00.01 |
I2C | 1 |
I2S | 0 |
Instruction Set Architecture | CISC |
Lead Shape | Gull-wing |
Max Processing Temp | 260 |
Maximum Clock Frequency | 5 MHz |
Maximum Expanded Memory Size | 64 KB |
Moisture Sensitive | Yes |
Mounting Style | SMD/SMT |
Number of ADCs | Single |
Number of I/O | 22 |
Number of Programmable I/Os | 22 |
Number of Timers/Counters | 1 |
On-Chip ADC | 16-chx10-bit |
Operating Supply Voltage | 3.3, 5 V |
Operating Temperature | -40°C ~ 125°C (TA) |
Oscillator Type | Internal |
Package / Case | 28-TSSOP (0.173", 4.40mm Width) |
Packaging | Tape & Reel (TR) |
Parallel Master Port | No |
PCB changed 28 | 28 |
Peripherals | POR, PWM, WDT, LVD, I2C |
Pin Count | 28 |
Product Category | 8-bit Microcontrollers - MCU |
Product Dimensions | 9.8 x 4.5 x 1.05 mm |
Program Memory Size | 16KB (16K x 8) |
Program Memory Type | FLASH |
PWM | 4 |
Qualification | AEC-Q100 |
Radiation Hardening | No |
RAM Size | 1K x 8 |
REACH Compliant | Yes |
REACH Compliant | Yes |
Real Time Clock | No |
Risk Rank | 5.45 |
Rohs Code | Yes |
Series | S08 |
Speed | 40 MHz |
SPI | 1 |
Standard Package Name | SOP |
Subcategory | Microcontrollers - MCU |
Supplier Device Package | 28-TSSOP |
Supplier Package | TSSOP |
Supplier Temperature Grade | Automotive |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
UART | 0 |
USART | 0 |
USB | 0 |
Voltage - Supply (Vcc/Vdd) | 2.7V ~ 5.5V |
Watchdog | 1 |
S9S08SG16E1MTLR Datasheet PDF Download:
Pinouts
Figure 1. 20-Pin TSSOP
Figure 2. 16-Pin TSSOP
Figure 3. 8-Pin SOIC
Description
The 8-bit S08SG family of microcontrollers (MCUs) is an entry-level to mid-range offering designed for LIN slave, general market, high-temperature (up to 150 °C ambient) and space-constrained applications. The SG is easy to design into an application because of its non-intrusive, single-wire background debug module (BDM), which allows you to read registers without stopping execution on the chip. This reduces development time, since changes can be made while in application and in real time. It also allows debug access in constrained locations. The SG helps to lower cost, save board space and improve quality with on-chip components by eliminating the need for external crystal, low-voltage interrupt (LVI) circuit, voltage regulator, I/O mux, watchdog circuit, analog-to-digital converter (ADC) and development tools. The SG family is also pin-compatible with the S08EL and S08SL families. This flexibility allows for upgrading and downgrading without major board redesign or long and expensive development times.
Features
40 MHz core
4-32 KB flash range
256B-1 KB RAM range
1 universal asynchronous receiver/transmitter (UART), 1 serial peripheral interface (SPI), 1 inter-integrated circuit (IIC)
Up to 16-channel, 10-bit ADC
1 analog comparator
In-circuit emulation (ICE) with real-time bus capture
Single-wire background debug module (BDM)
Four package options
Other data sheets within the file:
Datasheets | |
MC9S08SG16, 32 |  |
Environmental Information | |
NXP RoHS3 Cert |  |
PCN Design/Specification | |
Copper Wire/Compound Update 23/Jan/2015 |  |
PCN Other | |
MPQ Update 13/Jan/2015 |  |
Test/Quality Data | |
Material Composition |  |
RoHS Certificate of Analysis |  |
Statement on EU REACH Provisions |  |
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