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Nov 2 2019

MPC8572EVTARLD Datasheet PDF - IC MPU MPC85XX 1023BGA NXP

Product Overview

Product Category:

IC Chips

Kynix Part #:

KY32-MPC8572EVTARLD

Manufacturer Part#:

MPC8572EVTARLD

Manufacturer

NXP USA Inc.

Description:

IC MPU MPC85XX 1.067GHZ 1023BGA

Package:

1023-BFBGA, FCBGA

Datasheet:

MPC8572EVTARLD Datasheet

Stock:

Yes

Quantity:

70 PCS


MPC8572EVTARLD Images are for reference only:

MPC8572EVTARLD Image 


Product Specifications 

Categories

Integrated Circuits (ICs)

Embedded - Microcontrollers

Series

MPC85xx

Status

Obsolete

Package Description

33 X 33 MM, LEAD FREE, PLASTIC, FCBGA-1023

EU RoHS Compliant

Yes

REACH Compliant

Yes

Address Bus Width

32

Brand

NXP / Freescale

Base Part Number

MPC8572

Boundary Scan

Yes

Core Processor

PowerPC e500

Clock Frequency-Max

133 MHz

Co-Processors/DSP

Signal Processing; SPE, Security; SEC

Data Bus Width

32 bit

Ethernet

10/100/1000Mbps (4)

External Data Bus Width

32

Format

FLOATING POINT

Graphics Acceleration

No

I/O Voltage

1.5, 1.8, 2.5, 3.3V

Integrated Cache

Yes

JESD-30 Code

S-PBGA-B1023

JESD-609 Code

e2

Low Power Mode

Yes

Moisture Sensitive

Yes

Mounting Style

SMD/SMT

Max I/O Voltage

3.3 V

Number of Bits

32-Bit

Number of Cores

2

Number of Pins

1023

Length

33 mm

Width

33 mm

Operating Temperature

0°C ~ 105°C (TA)

Operating Supply Voltage

1.1 V

Packaging

Tray

Package / Case

1023-BFBGA, FCBGA

Supplier Device Package

1023-FCPBGA (33x33)

Package Body Material

PLASTIC/EPOXY

Package Code

HBGA

Package Equivalence Code

BGA1023,32X32,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

245

Power Supplies

1.1,1.8/3.3 V

Qualification Status

Not Qualified

RAM Size

1 MB

RAM Controllers

DDR2, DDR3

Radiation Hardening

No

RoHS

Compliant

Speed

1.067 GHz

Seated Height-Max

3.38 mm

Security Features

Cryptography, Random Number Generator

Supply Voltage-Max

1.155 V

Supply Voltage-Min

1.1 V

Supply Voltage-Nom

1.045 V

Subcategory

Microprocessors

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver (Sn/Ag)

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Lead Free Status / RoHS Status

Lead free / ROHS3 Compliant

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Additional Interfaces

DUART, HSSI, I²C, RapidIO


MPC8572EVTARLD Datasheet PDF Download:

MPC8572EVTARLD Datasheet PDF

Block Diagram

MPC8572E Block Diagram 

Fig. 1 MPC8572E Block Diagram

Description

Next-generation PowerQUICC® III integrated communications processors are designed to provide solutions for symmetrical and asymmetrical multi-core systems. Based on the scalable e500 processor and system-on-chip (SoC) platform, they deliver dual-core gigahertz plus processing performance with advanced content processing and security features.

The MPC8572E family of processors offers clock speeds from 1.2 GHz up to 1.5 GHz, combining two powerful e500 processor cores built on Power Architecture® technology, enhanced peripherals and high-speed interconnect technology to balance processor performance with I/O system throughput. These processors also contain application acceleration blocks such as a table lookup unit (TLU) that offloads complex table searches and header inspections, a pattern-matching engine to handle regular expression matching with a deflate engine to manage file decompression and a security engine that accelerates crypto operations in IPsec and SSL/TLS for VPNs.

Based on NXP®.s 90 nm silicon-on-insulator (SOI) copper interconnect process technology, the MPC8572E is designed to deliver higher performance with lower power dissipation. The MPC8572E processors provide a significant performance increase and represent continuous innovation from the popular PowerQUICC family. With uncompromising integration, the MPC8572E platform builds on the embedded core performance of Power Architecture technology and adds new features to enhance traffic management and security acceleration.

Support for high-speed interfaces on the MPC8572E enables scalable connectivity to network processors and/or ASICs in the data plane while the MPC8572E platform handles complex, computationally demanding control plane processing tasks. These processors include dual memory controllers supporting DDR2 and DDR3 for future proofing and error correction codes for high reliability, enhanced Gigabit Ethernet (GbE) support and double precision floating point.

Features

Dual e500 Power Architecture cores scaling to 1.5 GHz

1 MB L2 cache/SRAM with I/O stashing

32 KB I/D L1 cache per core

Dual integrated DDR2/DDR3 SDRAM memory controllers

  • 64-bits (72-bits with ECC) per controller

  • to 800 MHz datarate

Four integrated Ethernet controllers (enhanced TSEC)

  • 10/100/1000 support

  • TCP/UPD offload

  • Quality of service support

  • IEEE® 1588 support

  • Lossless flow control

  • SGMII interfaces

Single 10/100 fast Ethernet controller (FEC) with MII (muxed)

TLU offloading complex table searches

Pattern matching engine searches for regular expressions within packet payloads

  • Includes packet deflate engine to expose zipped payloads

Security engine

  • DES, 3DES, MD-5, SHA-1/2, AES, RSA, RNG, Kasumi F8/F9 and ARC-4 encryption algorithms

PCI Express®

Serial RapidIO®

32-bit local bus running up to 133 MHz

Dual I²C, Dual DMA, DUART, multiprocessor interrupt controller, IEEE1149.1 JTAG test access port

1023-pin FC-PBGA package

Other data sheets within the file:

Datasheets

MPC8572E Hardware Spec

MPC8572E Hardware Spec

TBI Link Status Errata

TBI Link Status Errata

MPIC Double Interrupt Errata

MPIC Double Interrupt Errata

PCN Obsolescence/ EOL

MPC8572 Devices 25/May/2012

MPC8572 Devices 25/May/2012

Users Guide

MPC8572 Development System User’s Guide (REV 1)

MPC8572 Development System User’s Guide (REV 1)


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