Product Overview
Product Category: | Embedded - Microprocessors |
Kynix Part #: | KY32 - MPC8306SCVMAFDCA |
Manufacturer Part#: | MPC8306SCVMAFDCA |
Manufacturer | Freescale Semiconductor - NXP |
Description: | IC MPU MPC83XX 333MHZ 369BGA |
Package: | 369-LFBGA |
Datasheet: | |
Stock: | Yes |
Quantity: | 104 PCS |
MPC8306SCVMAFDCA Images are for reference only:
Product Specifications
Product Category | Embedded - Microprocessors |
Manufacturer | Freescale Semiconductor - NXP |
Part Status | Active |
Series | MPC83xx |
Package | 369-LFBGA |
Packaging | Tray |
Family Name | PowerQUICC II Pro |
Address Bus Width | 0.0 |
Bit Size | 32 |
Boundary Scan | Yes |
Core | e300c3 |
Core Processor | PowerPC e300c3 |
Co Processors DSP | Communications; QUICC Engine |
Clock Frequency Max | 66.67 MHz |
Device Core | e300 |
Data Bus Width | 32 bit |
Data Cache Size | 16 KB |
Display & Interface Controllers | - |
Ethernet | 3 |
Ethernet Speed | 10 Mbps/100 Mbps |
Ethernet Interface Type | MII/RMII |
External Data Bus Width | 0.0 |
Format | FLOATING POINT |
Graphics Acceleration | No |
I-O-Voltage | 1.8 V, 3.3 V |
Interface Type | CAN/Ethernet/I2C/SPI/UART/USB |
Instruction Type | Floating Point |
Integrated Cache | Yes |
Instruction Cache Size | 16 KB |
Instruction Set Architecture | RISC |
JESD-30 Code | S-PBGA-B369 |
JESD-609 Code | e2 |
Low Power Mode | Yes |
L1-Cache-Instruction-Memory | 16 kB |
L1-Cache-Data-Memory | 16 kB |
Memory Type | L1 Cache |
Mounting | Surface Mount |
Mountingstyle | SMD/SMT |
Multiply Accumulate | No |
Moisture Sensitivity Level | 3 |
Maximum CPU Frequency | 333 MHz |
Typical Operating Supply Voltage | 3.3 V |
Minimum Operating Supply Voltage | 3 V |
Maximum Operating Supply Voltage | 3.6 V |
Number of Cores | 1 Core |
Number of Terminals | 369 |
Number of CPU Cores | 1 |
Number of Cores Bus Width | 1 Core, 32-Bit |
Operating Supply Voltage | 1 V |
Operating Temperature Min | - 40 °C |
Operating Temperature Max | 105.0 °C |
Pin Count | 369 |
PCB changed | 369 |
Processor Series | PowerQUICC II Pro |
Package Case | MAPBGA-369 |
Package Body Material | PLASTIC/EPOXY |
Package Code | LFBGA |
Package Shape | SQUARE |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature | 260 °C |
RAM Controllers | DDR2 |
Speed | 333MHz |
Security Features | - |
Supply Voltage Nom | 1.0 V |
Supply Voltage Min | 0.95 V |
Supply Voltage Max | 1.05 V |
Seated Height Max | 1.61 mm |
Supplier Package | MAP-BGA |
Supplier Device Package | 369-PBGA (19x19) |
Standard Package Name | BGA |
Surface Mount | Yes |
Technology | CMOS |
Tradename | PowerQUICC |
Terminal Finish | TIN COPPER/TIN SILVER |
Terminal Form | BALL |
Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM |
RoHS Compliant | Yes |
Voltage-I-O | 1.8V, 3.3V |
Length | 19.0 mm |
Width | 19.0 mm |
Lead Shape | BALL |
Lead Free Status | Lead free |
ECCN | 3A991.a.2 |
I2C | 1 |
I2S | 0 |
CAN | 4 |
SPI | 1 |
USB | USB 2.0 (1) |
UART | 3 |
SATA | - |
USART | 0 |
Unit-Weight | 0.036516 oz |
MPC8306SCVMAFDCA Datasheet PDF Download:
Description
The MPC8306S incorporates the e300c3 (MPC603e-based) core built on Power Architecture® technology, which includes 16 Kbytes of each L1 instruction and data caches, dual integer units, and on-chip memory management units (MMUs). The MPC8306S also includes two DMA engines and a 16-bit DDR2 memory controller.
A new communications complex based on QUICC Engine technology forms the heart of the networking capability of the MPC8306S. The QUICC Engine block contains several peripheral controllers and a 32-bit RISC controller. Protocol support is provided by the main workhorses of the device—the unified communication controllers (UCCs). A block diagram of the MPC8306S is shown in the following figure.
Fig 1. Block Diagram
Each of the five UCCs can support a variety of communication protocols such as 10/100 Mbps MII/RMII Ethernet, HDLC and TDM.
In summary, the MPC8306S provides users with a highly integrated, fully programmable communications processor. This helps to ensure that a low-cost system solution can be quickly developed and offers flexibility to accommodate new standards and evolving system requirements.
Features
• High-performance M68HC08 CPU core
• e300c3 Power Architecture processor core
— Enhanced version of the MPC603e core
— High-performance, superscalar processor core with a four-stage pipeline and low interrupt latency times
— Floating-point, dual integer units, load/store, system register, and branch processing units
— 16-Kbyte instruction cache and 16-Kbyte data cache with lockable capabilities
— Dynamic power management
— Enhanced hardware program debug features
— Software-compatible with Freescale processor families implementing Power Architecture technology
— Separate PLL that is clocked by the system bus clock
— Performance monitor
• QUICC Engine block
— 32-bit RISC controller for flexible support of the communications peripherals with the following features:
— One clock per instruction
— Separate PLL for operating frequency that is independent of system’s bus and e300 core frequency for power and performance optimization
— 32-bit instruction object code
— Executes code from internal IRAM
— 32-bit arithmetic logic unit (ALU) data path
— Modular architecture allowing for easy functional enhancements
— Slave bus for CPU access of registers and multiuser RAM space
— 48 Kbytes of instruction RAM
— 16 Kbytes of multiuser data RAM
— Serial DMA channel for receive and transmit on all serial channels
— Five unified communication controllers (UCCs) supporting the following protocols and interfaces:
— 10/100 Mbps Ethernet/IEEE Std. 802.3® through MII and RMII interfaces.
— HDLC/Transparent (bit rate up to QUICC Engine operating frequency / 8)
— HDLC Bus (bit rate up to 10 Mbps)
— Asynchronous HDLC (bit rate up to 2 Mbps)
— Two TDM interfaces supporting up to 128 QUICC multichannel controller channels, each running at 64 kbps
For more information on QUICC Engine sub-modules, see QUICC Engine Block Reference Manual with Protocol Interworking.
• DDR SDRAM memory controller
— Programmable timing supporting DDR2 SDRAM
— Integrated SDRAM clock generation
— 16-bit data interface, up to 266-MHz data rate
— 14 address lines
— The following SDRAM configurations are supported:
— Up to two physical banks (chip selects), 256-Mbyte per chip select for 16 bit data interface.
— 64-Mbit to 2-Gbit devices with x8/x16 data ports (no direct x4 support)
— One 16-bit device or two 8-bit devices on a 16-bit bus,
— Support for up to 16 simultaneous open pages for DDR2
— One clock pair to support up to 4 DRAM devices
— Supports auto refresh
— On-the-fly power management using CKE
• Enhanced local bus controller (eLBC)
— Multiplexed 26-bit address and 8-/16-bit data operating at up to 66 MHz
— Eight chip selects supporting eight external slaves
— Four chip selects dedicated
— Four chip selects offered as multiplexed option
— Supports boot from parallel NOR Flash and parallel NAND Flash
— Supports programmable clock ratio dividers
— Up to eight-beat burst transfers
— 16- and 8-bit ports, separate LWE for each 8 bit
— Three protocol engines available on a per chip select basis:
— General-purpose chip select machine (GPCM)
— Three user programmable machines (UPMs)
— NAND Flash control machine (FCM)
— Variable memory block sizes for FCM, GPCM, and UPM mode
— Default boot ROM chip select with configurable bus width (8 or 16)
— Provides two Write Enable signals to allow single byte write access to external 16-bit eLBC slave devices
• Integrated programmable interrupt controller (IPIC)
— Functional and programming compatibility with the MPC8260 interrupt controller
— Support for external and internal discrete interrupt sources
— Programmable highest priority request
— Six groups of interrupts with programmable priority
— External and internal interrupts directed to host processor
— Unique vector number for each interrupt source
• Universal serial bus (USB) dual-role controller
— Designed to comply with Universal Serial Bus Revision 2.0 Specification
— Supports operation as a stand-alone USB host controller
— Supports operation as a stand-alone USB device
— Supports high-speed (480-Mbps), full-speed (12-Mbps), and low-speed (1.5-Mbps) operations.
Low speed is only supported in host mode.
• Dual I2C interfaces
— Two-wire interface
— Multiple-master support
— Master or slave I2
C mode support
— On-chip digital filtering rejects spikes on the bus
— I2
C1 can be used as the boot sequencer
• DMA Engine
— Support for the DMA engine with the following features:
— Sixteen DMA channels
— All data movement via dual-address transfers: read from source, write to destination
— Transfer control descriptor (TCD) organized to support two-deep, nested transfer operations
— Channel activation via one of two methods (for both the methods, one activation per execution of the minor loop is required):
— Explicit software initiation
— Initiation via a channel-to-channel linking mechanism for continuous transfers (independent channel linking at end of minor loop and/or major loop)
— Support for fixed-priority and round-robin channel arbitration
— Channel completion reported via optional interrupt requests
— Support for scatter/gather DMA processing
• DUART
— Two 2-wire interfaces (RxD, TxD)
— The same can be configured as one 4-wire interface (RxD, TxD, RTS, CTS)
— Programming model compatible with the original 16450 UART and the PC16550D
• Serial peripheral interface (SPI)
— Master or slave support
• Power managemnt controller (PMC)
— Supports core doze/nap/sleep/ power management
— Exits low power state and returns to full-on mode when
— The core internal time base unit invokes a request to exit low power state
aracteristics
— The power management controller detects that the system is not idle and there are outstanding transactions on the internal bus or an external interrupt.
• Parallel I/O
— General-purpose I/O (GPIO)
— 56 parallel I/O pins multiplexed on various chip interfaces
— Interrupt capability
• System timers
— Periodic interrupt timer
— Software watchdog timer
— Eight general-purpose timers
• Real time clock (RTC) module
— Maintains a one-second count, unique over a period of thousands of years
— Two possible clock sources:
— External RTC clock (RTC_PIT_CLK)
— CSB bus clock
• IEEE Std. 1149.1™ compliant JTAG boundary scan
Other data sheets within the file:
Datasheet | |
MPC8306S Datasheet | ![]() |
MPC8306(S) Fact Sheet | ![]() |