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Jul 19 2019

MPC8275VRMIBA Datasheet PDF - IC MPU MPC82XX NXP FREESCALE

Product Overview

Product Category:

Embedded - Microprocessors

Kynix Part #:

KY32-MPC8275VRMIBA

Manufacturer Part#:

MPC8275VRMIBA

Manufacturer

NXP USA Inc.

Description:

IC MPU MPC82XX 266MHZ 516BGA

Package:

516-BBGA

Datasheet:

MPC8275VRMIBA Datasheet

Stock:

Yes

Quantity:

153 PCS


MPC8275VRMIBA Images are for reference only:

MPC8275VRMIBA Image 

Product Specifications 

Categories

Integrated Circuits (ICs)

Embedded - Microprocessors

Part Status

Active

Package Description

BGA, BGA516,26X26,40

Boundary Scan

Yes

Series

MPC82xx

Microprocessor/Microcontroller/Peripheral IC Type

MICROCONTROLLER

ADC Channels

Yes

Address Bus Width

32

Bit Size

32

Clock Frequency-Max

266 MHz

Device Core

PowerQUICC II

Data Bus Width (bit)

32

External Data Bus Width

64

Ethernet

10/100 Mbps (3)

Format

FLOATING POINT

Graphics Acceleration

No

Halogen Free

Halogen Free

Interface Type

Ethernet, I2C, PCI, USB

Instruction Type

Floating Point

Instruction Set Architecture

RISC

I/O Voltage

3.3 V

Integrated Cache

Yes

JESD-30 Code

S-PBGA-B516

JESD-609 Code

e2

Low Power Mode

No

Lead Finish

Tin/Silver

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Max Processing Temp

245

Maximum Speed

266 MHz

Moisture Sensitivity Level

3

Mounting

Surface Mount

Memory Size

16 KB

Number of CPU Cores

1

Number of Timers/Counters

4 x 16 bit

Number of Cores/Bus Width

1 Core, 32-Bit

Operating Temperature-Min

0 Cel

Operating Temperature-Max

105 Cel

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Product Category

Microprocessors - MPU

Processor Series

PowerQUICC II

Product Dimensions

27 x 27 x 1.95 mm

Package Equivalence Code

BGA516,26X26,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature

245 Cel

Power Supplies

1.5,3.3 V

PWM Channels

Yes

Packaging

Tray

Pin Count

516

PCB changed

516

Package / Case  

516-BBGA

Supplier Device Package

516-FPBGA (27x27)

Programmability

Yes

Watchdog

1

Qualification Status

Not Qualified

RAM Size

64 KB

Risk Rank

1.54

RAM Controllers

DRAM, SDRAM

Rohs Code

Yes

Seated Height-Max

2.55 mm

Sub Category

Other uPs/uCs/Peripheral ICs

Supply Voltage-Nom

1.5 V

Supply Voltage-Min

1.4 V

Supply Voltage-Max

1.6 V

Supplier Package

FBGA

Technology

CMOS

Temperature Grade 

INDUSTRIAL

Terminal Finish

TIN COPPER/TIN SILVER

Terminal Form

BALL

Terminal Pitch

1.0 mm

Tradename  

PowerQUICC

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Length

27 mm

Width

27 mm

Height

1.95 mm

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

USB

USB 2.0 (1)

Additional Interfaces

I²C, SCC, SMC, SPI, UART, USART

MPC8275VRMIBA Datasheet PDF Download:

MPC8275VRMIBA Datasheet PDF

Block Diagram

 SoC Block Diagram

Fig. 1 SoC Block Diagram

Notes:

1 MPC8280 only (not on MPC8270, the VR package, nor the ZQ package)

2 MPC8280 has 2 serial interface (SI) blocks and 8 TDM ports. MPC8270 and the VR and ZQ packages have only 1 SI block and 4 TDM ports (TDM2[A–D]).

3 MPC8280, MPC8275VR, MPC8275ZQ only (not on MPC8270, MPC8270VR, nor MPC8270ZQ)

Description

Introducing the next generation of PowerQUICC II processors: the MPC8270, MPC8275 and MPC8280. Utilizing Freescale's HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture. The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Freescale's PowerQUICC II processors include a high-performance embedded 603e core built on Power Architecture technology and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded core and provides support for multiple communications protocols, including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family. A range of performance and package options Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's industry-leading ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards. The next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.

Features

  • 603e core with 16K inst and 16K data caches

  • 64-bit 60x bus, 32-bit Local / PCI bus

  • 128K ROM, 32K IRAM, 32K DPRAM

  • Three FCCs supporting ATM, 10/100 Ethernet or HDLC (no IMA/TC support)

  • 128 HDLC channels, 4 TDMs

  • 4 SCCs, 2 SMCs, SPI, I2C

  • Memory controller built from SDRAM, UPM, GPCM machines

  • New features -- USB, RMII, UTOPIA improvements

  • Performance

266 MHz CPU, 200 MHz CPM, 66 MHz bus

~1W @ full performance, 1.5V

  • Technology

HIP7AP .13 micron, 3.3V I/O, 1.5V Core

516 PBGA, 27x27mm, 1mm ball pitch

ZQ package has lead-bearing spheres

VR package is lead-free

Other data sheets within the file:

Datasheets

MPC8280 PowerQUICC II Family

MPC8280 PowerQUICC II Family

Application Notes

CPM Architecture and Downloading RAM Microcodes on the PowerQUICC II Family

CPM Architecture and Downloading RAM Microcodes on the PowerQUICC II Family

CPM/CPU Interaction

CPM/CPU Interaction

Differences Among PowerQUICC II Devices and Revisions

Differences Among PowerQUICC II Devices and Revisions

Interfacing SDRAM Devices to the PowerQUICC MPC8280 at 100 MHz

Interfacing SDRAM Devices to the PowerQUICC MPC8280 at 100 MHz

MPC8260 Reset and Configuration Word

MPC8260 Reset and Configuration Word

MPC8260 SDRAM Support

MPC8260 SDRAM Support

MPC82xx PowerQUICC II Reset Sources and Effects

MPC82xx PowerQUICC II Reset Sources and Effects

Test/Quality Data

Material Composition

Material Composition

RoHS Certificate of Analysis

RoHS Certificate of Analysis

Statement on EU REACH Provisions

Statement on EU REACH Provisions


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