Product Overview
Product Category: | Embedded - Microprocessors |
Kynix Part #: | KY32-MPC8275VRMIBA |
Manufacturer Part#: | MPC8275VRMIBA |
Manufacturer | NXP USA Inc. |
Description: | IC MPU MPC82XX 266MHZ 516BGA |
Package: | 516-BBGA |
Datasheet: | |
Stock: | Yes |
Quantity: | 153 PCS |
MPC8275VRMIBA Images are for reference only:
Product Specifications
Categories | Integrated Circuits (ICs) Embedded - Microprocessors |
Part Status | Active |
Package Description | BGA, BGA516,26X26,40 |
Boundary Scan | Yes |
Series | MPC82xx |
Microprocessor/Microcontroller/Peripheral IC Type | MICROCONTROLLER |
ADC Channels | Yes |
Address Bus Width | 32 |
Bit Size | 32 |
Clock Frequency-Max | 266 MHz |
Device Core | PowerQUICC II |
Data Bus Width (bit) | 32 |
External Data Bus Width | 64 |
Ethernet | 10/100 Mbps (3) |
Format | FLOATING POINT |
Graphics Acceleration | No |
Halogen Free | Halogen Free |
Interface Type | Ethernet, I2C, PCI, USB |
Instruction Type | Floating Point |
Instruction Set Architecture | RISC |
I/O Voltage | 3.3 V |
Integrated Cache | Yes |
JESD-30 Code | S-PBGA-B516 |
JESD-609 Code | e2 |
Low Power Mode | No |
Lead Finish | Tin/Silver |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Max Processing Temp | 245 |
Maximum Speed | 266 MHz |
Moisture Sensitivity Level | 3 |
Mounting | Surface Mount |
Memory Size | 16 KB |
Number of CPU Cores | 1 |
Number of Timers/Counters | 4 x 16 bit |
Number of Cores/Bus Width | 1 Core, 32-Bit |
Operating Temperature-Min | 0 Cel |
Operating Temperature-Max | 105 Cel |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Product Category | Microprocessors - MPU |
Processor Series | PowerQUICC II |
Product Dimensions | 27 x 27 x 1.95 mm |
Package Equivalence Code | BGA516,26X26,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Peak Reflow Temperature | 245 Cel |
Power Supplies | 1.5,3.3 V |
PWM Channels | Yes |
Packaging | Tray |
Pin Count | 516 |
PCB changed | 516 |
Package / Case | 516-BBGA |
Supplier Device Package | 516-FPBGA (27x27) |
Programmability | Yes |
Watchdog | 1 |
Qualification Status | Not Qualified |
RAM Size | 64 KB |
Risk Rank | 1.54 |
RAM Controllers | DRAM, SDRAM |
Rohs Code | Yes |
Seated Height-Max | 2.55 mm |
Sub Category | Other uPs/uCs/Peripheral ICs |
Supply Voltage-Nom | 1.5 V |
Supply Voltage-Min | 1.4 V |
Supply Voltage-Max | 1.6 V |
Supplier Package | FBGA |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN COPPER/TIN SILVER |
Terminal Form | BALL |
Terminal Pitch | 1.0 mm |
Tradename | PowerQUICC |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Length | 27 mm |
Width | 27 mm |
Height | 1.95 mm |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
USB | USB 2.0 (1) |
Additional Interfaces | I²C, SCC, SMC, SPI, UART, USART |
MPC8275VRMIBA Datasheet PDF Download:
Block Diagram
Fig. 1 SoC Block Diagram
Notes:
1 MPC8280 only (not on MPC8270, the VR package, nor the ZQ package)
2 MPC8280 has 2 serial interface (SI) blocks and 8 TDM ports. MPC8270 and the VR and ZQ packages have only 1 SI block and 4 TDM ports (TDM2[A–D]).
3 MPC8280, MPC8275VR, MPC8275ZQ only (not on MPC8270, MPC8270VR, nor MPC8270ZQ)
Description
Introducing the next generation of PowerQUICC II processors: the MPC8270, MPC8275 and MPC8280. Utilizing Freescale's HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture. The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Freescale's PowerQUICC II processors include a high-performance embedded 603e core built on Power Architecture technology and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded core and provides support for multiple communications protocols, including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family. A range of performance and package options Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's industry-leading ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards. The next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.
Features
603e core with 16K inst and 16K data caches
64-bit 60x bus, 32-bit Local / PCI bus
128K ROM, 32K IRAM, 32K DPRAM
Three FCCs supporting ATM, 10/100 Ethernet or HDLC (no IMA/TC support)
128 HDLC channels, 4 TDMs
4 SCCs, 2 SMCs, SPI, I2C
Memory controller built from SDRAM, UPM, GPCM machines
New features -- USB, RMII, UTOPIA improvements
Performance
266 MHz CPU, 200 MHz CPM, 66 MHz bus
~1W @ full performance, 1.5V
Technology
HIP7AP .13 micron, 3.3V I/O, 1.5V Core
516 PBGA, 27x27mm, 1mm ball pitch
ZQ package has lead-bearing spheres
VR package is lead-free
Other data sheets within the file: