MCIMX356AVM5B Datasheet PDF - IC MPU I.MX35 400MAPBGA NXP

Product Overview

Product Category:	IC Chips
Kynix Part #:	KY32-MCIMX356AVM5B
Manufacturer Part#:	MCIMX356AVM5B
Manufacturer	NXP USA Inc.
Description:	IC MPU I.MX35 532MHZ 400MAPBGA
Package:	400-LFBGA
Datasheet:	MCIMX356AVM5B Datasheet
Stock:	Yes
Quantity:	116 PCS

MCIMX356AVM5B Images are for reference only:

Product Specifications

Categories	Integrated Circuits (ICs) Embedded - Microprocessors
Part Status	Active
Base Part Number	MCIMX356
China RoHS Compliant	Yes
Co-Processors/DSP	Multimedia; GPU, IPU, VFP
Core Architecture	ARM
Core Processor	ARM1136JF-S
Data Bus Width	32 bit
Data Cache Size	16 kB
Data RAM Size	128 kB
Data ROM Size	32 kB
Display & Interface Controllers	Keypad, KPP, LCD
ECCN Code	5A992
Ethernet	10/100Mbps (1)
EU RoHS Compliant	Yes
Frequency	532 MHz
Graphics Acceleration	Yes
Halogen Free	Halogen Free
HTS Code	8542.31.00.01
Height	1.18 mm
Interface	I2C, SPI, USB, CAN, Ethernet, MMC, UART, USART, EBI/EMI
I/O Voltage	1.75 V to 3.6 V
Instruction Cache Size	16 kB
JESD-30 Code	S-PBGA-B400
Length	17 mm
L1 Cache Instruction Memory	16 kB
L1 Cache Data Memory	16 kB
Max Supply Voltage	1.47V
Memory Type	SRAM, ROM, L2 Cache, ROMless
Min Supply Voltage	1.33 V
Moisture Sensitivity Level	3
Mount	Surface Mount
Memory Type	L1/L2 Cache, ROM, SRAM
Number of Cores/Bus Width	1 Core, 32-Bit
Number of Timers/Counters	1
Number of I/Os	96
Number of Pins	400
Number of Terminals	400
Operating Temperature	-40°C ~ 85°C (TA)
Oscillator Type	External
Package / Case	400-LFBGA
Package Body Material	PLASTIC/EPOXY
Package Code	LFBGA
Package Description	17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400
Package Quantity	90
Programmability	Yes
Package Shape	SQUARE
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH
Processor Series	i.MX356
Packaging	Tray
Product Dimensions	17 x 17 x 1.18 mm
Peak Reflow Temperature (Cel)	260
Peripherals	POR, PWM, WDT, DMA, LCD
Product Type	Processors - Application Specialized
Qualification Status	Not Qualified
Radiation Hardening	No
RAM Controllers	LPDDR, DDR2
RAM Size	128 kB
Risk Rank	5.45
Rohs Code	Yes
SPI	2
I2C	3
I2S	2
UART	2
USB	2
USART	0
CAN	2
PCI	0
Ethernet	1
SATA	-
Seated Height-Max	1.6 mm
Security Features	Secure Fusebox, Secure JTAG
Series	i.MX35
Speed	532 MHz
Status	Transferred
Supplier Device Package	400-MAPBGA (17x17)
Surface Mount	Yes
Temperature Grade	INDUSTRIAL
Terminal Finish	Tin/Silver/Copper - with Nickel barrier
Terminal Form	BALL
Terminal Pitch	0.8 mm
Terminal Position	BOTTOM
Tradename	i.MX
Time@Peak Reflow Temperature-Max (s)	40
USB	USB 2.0 + PHY (2)
Voltage - I/O	1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Width	17 mm
Additional Interfaces	1-Wire, ASRC, ATA, CAN, I²C, I²S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Application	Multimedia Applications

MCIMX356AVM5B Datasheet PDF Download:

Block Diagram

Figure 1. i.MX35 Simplified Interface Block Diagram

Description

The i.MX356 provides all of the functionality required in today’s automotive market. With an ARM11 core running at 532 MHz the i.MX356 integrates an OpenVG 1.1 vector graphics hardware accelerator. The OpenVG was integrated to deliver smooth textural visuals required in today’s automotive infotainment systems. The processor features an advanced Image Processing Unit (IPU) with updated resizing capabilities to handle wide-VGA and increased the interface to 24-bit for higher color display capabilities. To reduce BOM cost flexible connectivity options were integrated, such as 2-CAN modules, Media Local Bus (MLB), Enhanced Serial Audio Interface (ESAI), Ethernet, and two USB ports with integrated PHYs. The i.MX356 can connect too many different peripherals like Wi-Fi via SDIO or USB, Bluetooth via UART or SSI/I2S and external storage via CE-ATA or PATA. Support for lower cost memories like 3.3V SDRAM, DDR2, and multi-level cell NAND were integrated. The i.MX356 is supported by companion Freescale power management ICs (PMIC), MC13892 and MMPF0100.

Features