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Mar 4 2020

MCIMX356AVM5B Datasheet PDF - IC MPU I.MX35 400MAPBGA NXP

Product Overview

Product Category:

IC Chips

Kynix Part #:

KY32-MCIMX356AVM5B

Manufacturer Part#:

MCIMX356AVM5B

Manufacturer

NXP USA Inc.

Description:

IC MPU I.MX35 532MHZ 400MAPBGA

Package:

400-LFBGA

Datasheet:

MCIMX356AVM5B Datasheet

Stock:

Yes

Quantity:

116 PCS


MCIMX356AVM5B Images are for reference only:

MCIMX356AVM5B Image 

Product Specifications

Categories

Integrated Circuits (ICs)

Embedded - Microprocessors

Part Status

Active

Base Part Number

MCIMX356

China RoHS Compliant

Yes

Co-Processors/DSP

Multimedia; GPU, IPU, VFP

Core Architecture

ARM

Core Processor

ARM1136JF-S

Data Bus Width

32 bit

Data Cache Size

16 kB

Data RAM Size

128 kB

Data ROM Size

32 kB

Display & Interface Controllers

Keypad, KPP, LCD

ECCN Code

5A992

Ethernet

10/100Mbps (1)

EU RoHS Compliant

Yes

Frequency

532 MHz

Graphics Acceleration

Yes

Halogen Free

Halogen Free

HTS Code

8542.31.00.01

Height

1.18 mm

Interface

I2C, SPI, USB, CAN, Ethernet, MMC, UART, USART, EBI/EMI

I/O Voltage

1.75 V to 3.6 V

Instruction Cache Size

16 kB

JESD-30 Code

S-PBGA-B400

Length

17 mm

L1 Cache Instruction Memory

16 kB

L1 Cache Data Memory

16 kB

Max Supply Voltage

1.47V

Memory Type

SRAM, ROM, L2 Cache, ROMless

Min Supply Voltage

1.33 V

Moisture Sensitivity Level

3

Mount

Surface Mount

Memory Type

L1/L2 Cache, ROM, SRAM

Number of Cores/Bus Width

1 Core, 32-Bit

Number of Timers/Counters

1

Number of I/Os

96

Number of Pins

400

Number of Terminals

400

Operating Temperature

-40°C ~ 85°C (TA)

Oscillator Type

External

Package / Case

400-LFBGA

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Description

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Package Quantity

90

Programmability

Yes

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Processor Series

i.MX356

Packaging

Tray

Product Dimensions

17 x 17 x 1.18 mm

Peak Reflow Temperature (Cel)

260

Peripherals

POR, PWM, WDT, DMA, LCD

Product Type

Processors - Application Specialized

Qualification Status

Not Qualified

Radiation Hardening

No

RAM Controllers

LPDDR, DDR2

RAM Size

128 kB

Risk Rank

5.45

Rohs Code

Yes

SPI

2

I2C

3

I2S

2

UART

2

USB

2

USART

0

CAN

2

PCI

0

Ethernet

1

SATA

-

Seated Height-Max

1.6 mm

Security Features

Secure Fusebox, Secure JTAG

Series

i.MX35

Speed

532 MHz

Status

Transferred

Supplier Device Package

400-MAPBGA (17x17)

Surface Mount

Yes

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Silver/Copper - with Nickel barrier

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Tradename

i.MX

Time@Peak Reflow Temperature-Max (s)

40

USB

USB 2.0 + PHY (2)

Voltage - I/O

1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Width

17 mm

Additional Interfaces

1-Wire, ASRC, ATA, CAN, I²C, I²S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART

Application

 Multimedia Applications


MCIMX356AVM5B Datasheet PDF Download:

MCIMX356AVM5B Datasheet PDF

Block Diagram

 i.MX35 Simplified Interface Block Diagram 

Figure 1. i.MX35 Simplified Interface Block Diagram

Description

The i.MX356 provides all of the functionality required in today’s automotive market. With an ARM11 core running at 532 MHz the i.MX356 integrates an OpenVG 1.1 vector graphics hardware accelerator. The OpenVG was integrated to deliver smooth textural visuals required in today’s automotive infotainment systems. The processor features an advanced Image Processing Unit (IPU) with updated resizing capabilities to handle wide-VGA and increased the interface to 24-bit for higher color display capabilities. To reduce BOM cost flexible connectivity options were integrated, such as 2-CAN modules, Media Local Bus (MLB), Enhanced Serial Audio Interface (ESAI), Ethernet, and two USB ports with integrated PHYs. The i.MX356 can connect too many different peripherals like Wi-Fi via SDIO or USB, Bluetooth via UART or SSI/I2S and external storage via CE-ATA or PATA. Support for lower cost memories like 3.3V SDRAM, DDR2, and multi-level cell NAND were integrated. The i.MX356 is supported by companion Freescale power management ICs (PMIC), MC13892 and MMPF0100.

Features

  • ARM1136JF-S™

  • 532 MHz maximum speed

  • 128 KB Integrated SRAM

  • 16 KB I/D L1 Cache, 128 KB L2 cache

  • MLB

  • ESAI

  • OpenVG 1.1 vector graphics hardware accelerator

  • Image Processing Unit (IPU)

  • LCD Controller

  • 10/100 Ethernet

  • MAC 2 x FlexCan modules

  • HS OTG + PHY, HS Host + PHY

  • 3 x UART, 2 x CSPI, 3 I2C, 2 SSI/I2S

  • P-ATA/CE-ATA

  • Optimized for up to 24-bit-per-pixel WVGA

  • CMOS/CCD sensor interface

  • Vector Floating Point Unit

  • External memory interface: mSDRAM/SDRAM, mDDR/DDR2, NOR, SLC/MLC NAND

  • 3.3V general purpose I/O

Other data sheets within the file:

Datasheets

MCIMX351,355,356

MCIMX351,355,356

Environmental Information

NXP RoHS3 Cert

NXP RoHS3 Cert

Test/Quality Data

Material Composition

Material Composition

Statement on EU REACH Provisions

Statement on EU REACH Provisions


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